Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.
Sponsored by Global SMT & Packaging magazine, the award acknowledges outstanding innovations in the printed circuit board assembly and packaging industry. The award was presented to Tim Jensen, Product Manager – PCB Assembly Materials, and Brian Craig, Managing Director – European Operations.
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SACM™ offers superior dro test performance compared to SAC305 and SAC105, with the added benefit of thermal cycling reliability equivalent to that of SAC305. This development is especially meaningful for the manufacture of consumer electronics that normally see frequent handling and occasional misuse.
SACM™ is manufactured into solder paste using the Indium8.9 Series flux, making it ideal for miniaturized components and fine-pitch assembly. It is specifically designed for CSP, 0201, and 01005 components. Its first-class printing performance provides excellent print transfer through apertures with area ratios of less than 0.66.
Learn more about SACM™ at www.indium.com/SACM.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.