Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.
Dr. Lee’s presentation, Shock Resistant and Thermally Reliable Low-Ag SAC Solder Doped with Mn for Portable Medical Devices, discusses a new soldering alloy doped with Mn, and its considerable improvement in shock resistance and thermal fatigue performance.
Dr. Lasky’s presentation, Tin Whiskers: Causes, Risks, and Mitigation, reviews what tin whiskers are, how they form, mitigation techniques, and how to use failure modes and effects analysis as techniques to assess tin whisker risk.


Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.