Indium5.8LS SAC305 锡膏

• Ultra-low fl ux spattering (ideal for applications with

Au fi nger connectors)

• Ultra-low solder beading

• Halogen-free

• Superior stencil life

• Outstanding print characteristics

• Extremely wide process window

Introduction

Indium5.8LS is a halide-free, no-clean solder paste

specifi cally formulated for low fl ux spatter. This

material is designed to accommodate the higher

processing temperatures required by the Sn/Ag/Cu,

Sn/Ag, and other Pb-Free alloy systems in an air or

nitrogen refl ow atmosphere. This product formulation

offers consistent, repeatable printing performance

combined with long stencil and tack times to handle

the rigors of today’s high speed as well as high mix

surface mount lines.

Packaging

Standard packaging for

stencil printing applications

includes 4 oz. jars and 6 oz.

or 12 oz. cartridges. Packaging

for enclosed print head systems

is also readily available. For

dispensing applications, 10cc and

30cc syringes are standard. Other

packaging options may be available upon

request.