SAC305/INDIUM10.1HF/TYPE4/89%

Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to have ultra-low voiding, including for designs that incorporate large ground pads otherwise known as bottom termination components (BTCs). BTCs include packages such as QFNs, DPAKs, and MOSFETs. The flux chemistry is specifically engineered to improve reliability by minimizing voiding and maximizing ECM and head-in-pillow performance while also providing excellent wetting, solder beading, solder balling, and slump to meet IPC specifications. It is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. 

 Features

Ultra-low voiding, including bottom termination (BTC) assemblies

High ECM performance under low standoff components

Outstanding solder beading, very low bridging, slump, solder balling, and head-in-pillow

Excellent wetting to fresh and aged common metallizations and surface finishes, including, but not limited to:

OSP

Immersion Sn

Immersion Ag

ENIG

Exceptional printing — high transfer efficiency and low variation

Halogen-free per IEC 61249-2-21, test method EN14582

 Alloys

Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. Type 3 and Type 4 powders are standard offerings with Pb-free alloys. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application. Standard product offerings are detailed in the specifications table.