Windows 7电脑操作界面,设计两种控制方式,电脑控制与紧急手动控制,具有安全保障功能;
领先的加热方式, 解决了回流焊焊接时的死角难题.适合CSP、BGA、0201CHIP等电器元件的焊接;
专业风轮设计,风速稳定,有效地防止了PCB板受热时风的均匀性,,达到最高的重复加热:
各温区采用强制独立循环,独立PID+SSR控制,上下同时加热方式,使炉腔温度准确,均匀,热容量大;
保温层采用优质钛合金铝保温材料,保温效果好,升温快,从室温到工作温度≤20min;
炉膛无铅环保设计,全部采用特铸制作;
优质高温高速马达运风平稳,震动小,噪音低;
炉体采用气缸顶升,中央支撑,安全方便;
PCB板的传送方式采用无级变频变速,网链同步,稳定性极佳;
特制优质铝合金导轨,自动加油系统,确保导轨调宽精确及高使用寿命;
配备断电保护功能UPS,保证断电后PCB板正常输出,不致损坏;
强大的软件功能,对PCB板在线测温,并随时对数据曲线进行分析,储存和打印;
自动监测,显示设备工作状态;
强制空气冷却;PCB板出机后温度≤60℃;
特殊炉胆设计,保温性好,耗电量达同行最低。
Windows 7系统,中英文界面在线任意切换,操作简便;
具有故障智能诊断功能,可显示各故障,自动在报警列表中显示及存储;
控制程序可自动生成和备份各项数据报表,便于ISO 9000管理。
Windows 7 operation system, so simply as Chinese and English interface onscreen alternative is available.
Intelligent Diagnosis System has the functions of Trouble Remind, Alarm,List-out, Report Saving.
All production data will be backup automatically, and easily for ISO 9000 management.
炉膛内使用全面保护的密闭式设计,有效保护氮气不易流失,使氧气含量最低可至150ppm;
氮耗量低,在300~800ppm氧浓度环境下只在20~22m?/H。
Use the full protection of the sealed oven design to prevent N2 and O2 from losing effectively.
So the lowest concentration of N2 and O2 can be reached to 150ppm.
When concentration of oxygen is 300-800ppm, N2 consumption is only 20-22m3 /H。
15%热传递效率的提升从容应对更复杂更大型焊接产品的无铅工艺要求.
15% Heat Transferring Efficiency was improved to deal with the lead free process with more complicated and larger products.
双导轨结构有效提高生产效率,节约能耗及生产成本。
The Dual-Rails conveyor is able to improve the production officiency as well as save power & cost.
加强主吊臂确保导轨无横向变形,杜绝卡板及掉板现象发生
Reiforced Main Hanging Bracketto guarantee there is no deforming and board jamming occurred.
加长的有效加热区、使热传导均匀充分、大大地提高了加热的效率。
The longer heating zones are able to get high production officiency and throughput.