YAMAHA YSM10基板流向改向资料

Table of contents
1. Parts required for the work ................................................3
2. The work procedures...........................................................4
2.1 Summery for the work procedures ............................. 4
2.2 The work procedures......................................... 5
2.3 Change the machine setting and turn the power and air off .............................. 6
2.4 How to remove the right and left cover and remove the PU plate ..................... 7
2.5 How to change the position of the entrance and exit sensor and exit stopper ..... 8
2.5.1 Remove the entrance sensor ........................ 8
2.5.2 Remove the exit sensor.......................................... 9
2.5.3 Remove the exit stopper.............................. 10
2.5.4 Fix the exit stopper ...................................... 12
2.5.5 Exchange the exit sensor and install it ............................ 14
2.5.6 Exchange the entrance sensor and install it................... 16
2.6 Change the direction the main stopper and the standby position stopper........... 18
2.7 How to change the position of the mounting position board detection sensor....... 19
2.7.1 Change the position of the receiver sensor of the fixed conveyor .......... 19
2.7.2 Change the position of the emitter sensor of the movable conveyor ........ 21
2.8 Exchange the connectors for signal wire interfacing with other machines .......... 23
2.8.1 Exchange the joint connectors ..................... 23
2.8.2 Exchange the signal wire relay harness of the conveyor I/O board ......... 25
2.8.3 Change the PREVIOUS/NEXT sticker .............. 26
3. Check and adjust after exchanging parts.................27
3.1 Turn power and air on .................... 27
3.2 Change the position of Edge Clamp ................... 27
3.3 Attach the PU plate ......................................................... 28
3.4 Check and adjust the flatness of the PU plate .................... 28
3.5 PU-axis – “Init move” adjustment ........................................ 29
3.6 Test PCB transfer............................................................... 30